Resin diamond micro-drill cylindrical grinding wheel

In order to solve the problems caused by the high hardness, high wear resistance, high brittleness, small bit diameter (0.10mm to 6.50mm) and other characteristics of the printed circuit board drill bit (also known as PCB drill bit), such as low processing efficiency, high reject rate and not sharp cutting edge, we produce a high-precision resin diamond micro-drill cylindrical grinding wheel.

The resin grinding wheel is composed of a matrix and a working abrasive layer, and the composition of the working abrasive layer is:

Resin binder 50-70, white corundum 10-20, nano-level mgo1-5, copper powder 5-15, nano-level tio21-10, diamond 10-20, cbn5-10.

Application:
Mainly used for small diameter tungsten, stainless steel or hss drills, micro drills, and end mills used in electronics, medical technology, and the automotive industry.

Advantages:
1.Good edge stability
2.High cutting efficiency
3.Minimal reject-part rates
4.Good round tool quality

Suitable Grinding Machine:
Startech, Kimer K360, Rollomatic, SAACKE, HAWEMA, Walter Helitronic, ANCA, Schneeberger Norma, DMG MORI, WALTER, EWAG and other all CNC tool grinding machines.

DRAWING&SPECIFICATION